Summary: Flow of orifice plate board undertakes the laser bore blind that to me the company has analysis, put forward to improve method of precision of counterpoint of laser blind aperture hand-in-hand travel experiment and analysis. Keyword: Target of mark of fixed position of counterpoint of aperture of laser bore blind one current situation spends direction to develop to miniaturization and high density as panel, more and more panel use means of the aperture that bury blind to realize high density to interrelate, laser bore is one of methods that implement tiny blind aperture. Intense market competition also raises taller and taller requirement to the dependability of panel, high to blind aperture reliability asks to have the nice link of large area, the contrapuntal precision with laser blind good aperture is a crucial factor. Need to explain laser gets blind aperture precision to ask to have two above all: Namely laser aperture and lining solder dish and outer solder dish the contrapuntal precision between. The flow of precision is counterpoint of my company's existing panel of aperture of blind of influence laser bore: 1, the fixed position of bore mark target that uses via drills fixed position hole; 2, by fixed position aperture fixed position passes laser aperture to nod phenanthrene forest to make outer laser window and target of mark of laser bore fixed position; 3, laser borer seeks target of mark of laser bore fixed position, drill laser blind hole next; 4, outer the graph is transferred make blind hole outer solder dish. 2 analysises 1, the generation error reason that each flow may exist: (1) get error of system of itself of smooth machine of A of fixed position aperture, X; B, panel is rough, cause strong mark target to rush forbid; C, on bore is in charge of people the hammer is incompact; Error of system of itself of D, borer; E, broach is secured not firm; F, panel is rough, adhesive plaster is stuck incompact. (2) make laser window: Aperture of A, laser nods phenanthrene forest to be out of shape; Aperture of B, laser nods phenanthrene forest counterpoint to forbid. (3) laser bore: Error of system of itself of drill of A, laser; B, panel is rough cause read forbid; Clip of C, panel is incompact. (4) outer graphical move: A, phenanthrene forest is out of shape; Counterpoint of B, phenanthrene forest forbids. Can see, above influence laser gets blind aperture to be opposite people the major reason of precision is operation problem, can be improved through strict operation. Besides the operation it is systematic error and orientation way, ameliorate systematic error cost exorbitant, the side should put the emphasis on the improvement of orientation way. The analysis of 2 orientation way: The mark target that shows some to locate means is to use via drills fixed position hole, next from this kind fixed position of fixed position opening becomes laser window and target of mark of laser fixed position at outer, laser borer is read take outer the bore after position of target of mark of laser fixed position. This orientation way puts in the following problem: When X smooth machine develops via mark target, undertake unity eclectic compensation to the borer mark target of each lining, determines value and solder of blind aperture lining dish the mark target that is in a layer is worth existence deviation. The fixed position hole that drills according to this mark target subsequently, etch the laser window that give and target of mark of laser fixed position cannot mirror solder of blind aperture lining dish the change that is in a layer. The laser hole that with this kind orientation way gets out is opposite at outer laser window and blind aperture are outer solder dish error is minor, but opposite at solder of blind aperture lining dish error is bigger. By afore-mentioned analysises knowable, if locate laser mark target does a layer inside directly, can mirror solder of blind aperture lining directly when bore dish the metabolic circumstance that is in a layer, improve laser aperture and lining solder dish contrapuntal deviation. But laser aperture and outer laser window and blind aperture are outer solder dish contrapuntal deviation slants big. If use solder of blind aperture lining dish the mark target fixed position that is in a layer, do laser window to be able to improve the contrapuntal deviation of laser aperture and laser window later like that, but external layer solder dish contrapuntal deviation won't be improved. According to lining the change of phenanthrene forest is opposite outer phenanthrene forest has corresponding compensation, outside improve laser aperture to be opposite layer solder dish contrapuntal deviation, but cause an effect to the counterpoint of via at the same time, this experiment of short duration takes no account of reason outer circuit poors forest compensation. 3 experiments 1, analyse according to above, we choose 15 6 orifice plate that bury blind (include 1-2 layer and hole of 5-6 layer blind) , use method of 3 kinds of location to have comparative test (every kinds of method 5 board) : (1) target of mark of 1-6 layer bore drills fixed position hole, outer target of mark of laser fixed position (at present the practice of my company) (2) target of mark of 1-6 layer bore drills fixed position hole, target of mark of lining laser fixed position (improve blind aperture and lining solder dish contrapuntal) (3) 1-2 and target of mark of 5-6 layer bore drill fixed position hole respectively, target of mark of lining laser fixed position (improve blind aperture and lining solder dish the counterpoint that reachs laser window) . 2, in lamination, laser getting and outer after etching, undertake detecting (detect the result sees subordinate list) : (1) 1-6, the dimension after 1-2 and lamination of target of mark of 5-6 layer bore changes (X smooth machine detects, the unit is Mil) ; (2) the contrapuntal circumstance between laser aperture and laser window (the biggest width of deflection of Kong Yuchuang mouth, measure with centuple magnifier, the unit is Mil) ; (3) laser aperture and lining solder dish connection case (aperture and lining solder dish the biggest width of join face, measure with centuple magnifier, the unit is Mil) ; (4) laser aperture and outer solder dish connection case (the smallest ring width, measure with centuple magnifier, the unit is Mil) ; (5) laser aperture and lining solder dish contrapuntal precision (the laser aperture that gauges board margin and lining solder dish the mark target of contrapuntal precision, the unit is Mil) ; 3, experimental data analysis: From laser aperture and lining solder dish the test of target of contrapuntal precision mark looks as a result, the board aperture precision that uses target of mark of lining laser fixed position is taller (report is opposite at lining solder dish precision) . But as a result of with outer the deviation of laser window, the location method that brings about the area ratio that is linked together finally with lining to have slants a little small. Laser aperture and outer solder dish contrapuntal deviation circumstance these 3 kinds of methods are about the same, soldering tin side is bad, should be soldering tin face outer circuit poors forest counterpoint forbids and cause. 4 conclusion locate from above experimental result of the method can see 3 kinds, the contrapuntal precision that with lining laser fixed position of target of fixed position mark undertakes laser bore can raise laser bore ((2) , (3) kind method; But (3) kind methodological need gets butt of two pairs of mark more, the influence manufactures efficiency, and laser hole is not large to the alignment circumstance improvement of laser window, reason appropriate is used (2) kind method) , but to assure nice join area, should increase laser window appropriately. Precision of bore of laser of change of target of layer mark of the 5-6 after lamination of change of target of mark of layer of the 1-2 after lamination of change of target of mark of layer of the 1-6 after lamination of method of panel number counterpoint (1-2) laser bore precision (5-6) laser aperture and lining solder dish connection case (1-2) laser aperture and lining solder, outer laser locates 4. 45 3.
98 2.
51 3.
25 3.
5 4.
43 4.
72 0.
98 collapse aperture 3.
19 3.
Bore of layer of 15 10 1-6, outer laser locates 6.
14 3.
78 3.
78 3.
5 4.
5 4.
18 4.
13 0.
3 0.
3 3.
4 2.
Bore of layer of 56 14 1-6, outer laser locates 5.
24 2.
56 3.
46 5 6 3.
69 2.
56 0.
39 1.
37 3.
35 2.
Bore of layer of 95 16 1-6, outer laser locates 4.
69 4.
09 3.
39 3.
5 3.
5 4.
43 4.
04 0.
69 collapse aperture 3.
15 2.
Bore of layer of 56 17 1-6, outer laser locates 4.
96 3.
31 4.
41 6.
25 4 2.
76 4.
72 0.
39 0.
98 3.
3 2.
Bore of layer of 6 1 1-6, lining laser locates 6.
61 5.
35 3.
94 2 3 4.
38 4.
53 0.
39 collapse aperture 3.
49 4.
Bore of layer of 28 8 1-6, lining laser locates 5.
67 3.
62 3.
11 3 3 3.
54 4.
72 1.
67 0.
2 5.
21 4.
Bore of layer of 23 13 1-6, lining laser locates 6.
81 3.
27 3.
11 3.
25 4 3.
34 4.
63 1.
38 collapse aperture 5.
11 4.
Bore of layer of 23 15 1-6, lining laser locates 5.
51 3.
78 1.
97 3.
5 4.
25 4.
33 4.
72 0.
3 0.
44 5.
01 3.
Bore of layer of 05 18 1-6, lining laser locates 4.
69 3.
07 4.
64 2.
25 2.
5 2.
31 3.
99 1.
32 collapse aperture 6.
79 5.
81 4 1-2 reachs 5-6 layer bore, lining laser locates 6.
97 5.
87 4.
49 1.
75 1.
5 3.
94 3.
79 1.
08 0.
39 3.
84 5.
01 7 1-2 reachs 5-6 layer bore, lining laser locates 4.
61 2.
76 3.
7 2.
5 3.
75 4.
04 4.
72 1.
67 collapse aperture 4.
97 3.
99 11 1-2 reachs 5-6 layer bore, lining laser locates 5.
83 5.
24 4.
02 1.
25 1 4.
62 3.
84 0.
49 collapse aperture 3.
74 5.
22 19 1-2 reachs 5-6 layer bore, lining laser locates 4.
37 3.
11 2.
99 3.
25 2.
75 3.
44 2.
76 collapse aperture 0.
2 5.
22 6.
59 20 1-2 reachs 5-6 layer bore, lining laser locates 6.
18 6.
14 4.
17 2.
5 1 3.
35 3.
64 0.
3 0.
79 5.
41 5.
61 CNC Milling